MIJING CH3 3 in1 Universal Mainboard Layred Welding Platform For iPhone X/XS/XSMAX CPU chip HHD Baseband Glue Removal Spare Parts For Samsung S6 Edge Features：

Features：

Compatible with :ONLY for Xiaomi Mix 2

12mmType: MJ BGA Reballing StencilsModel: Tin Planting Template for iPhone SeriesDesign: Precison Square Hole Manual Planting Tin NetApplication: for iphone 5-XR NAND and iPad NAND heating template repairCompacible: for iPhone 5 6 6S 7 8 Plus XS MAX XR

5X synchronous new interface

Package: 1

MIJING CH3 3 in1 Universal Mainboard Layred Welding Platform For iPhone X/XS/XSMAX CPU chip HHD Baseband Glue Removal Spare Parts For Samsung S6 Edge Features：PRODUCT INTRODUCTION DIY Supplies: ELECTRICAL Certification: CE Origin: CN(Origin) Model Number: CH3 Package: Case Type: Combination Application: Computer Tool Kit PRODUCT FEATURES Three in one universal iPhone X XS XSMAX, support A11 A12 CPU chip, A11 A12 HHD, iPhoneX Baseband, iPhoneXS XSMAX baseband and glue removal. Precise positioning, precise temperature, rapid temperature rise, non slip weight increase, digital display temperature, intelligent